Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
College of Engineering / 工學院
Industrial Engineering / 工業工程學研究所
Spatial risk assessment on circular domains: Application to wafer profile monitoring
Details
Spatial risk assessment on circular domains: Application to wafer profile monitoring
Journal
2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference
Pages
223-227
Date Issued
2015
Author(s)
Padonou, E.
Roustant, O.
Blue, J.
Duverneuil, H.
JAKEY BLUE
DOI
10.1109/ASMC.2015.7164475
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/467307
URL
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84963677298&doi=10.1109%2fASMC.2015.7164475&partnerID=40&md5=395671dfee3a43e6ec591640698028ef
Type
conference paper