https://scholars.lib.ntu.edu.tw/handle/123456789/486036| Title: | Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder | Authors: | Chang, C. C. Yang, S. C. Chen, Y. J. Kao, C. R. CHIEN-CHENG CHANG |
Issue Date: | 2011 | Journal Volume: | 102 | Journal Issue: | 5 | Start page/Pages: | 579-583 | Source: | International Journal of Materials Research | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/486036 | ISSN: | 1862-5282 | DOI: | 10.3139/146.110502 |
| Appears in Collections: | 應用力學研究所 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
