Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder

Journal

International Journal of Materials Research

Journal Volume

102

Journal Issue

5

Pages

579-583

Date Issued

2011

Author(s)

Chang, C. C.

Yang, S. C.

Chen, Y. J.

CHIEN-CHENG CHANG

DOI

10.3139/146.110502

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/486036

Type

journal article