Solder Ball 3D Reconstruction with X-Ray Images Using Filtered Back Projection
Journal
IEEE Region 10 Annual International Conference, Proceedings/TENCON
Journal Volume
2018-October
Pages
2510-2515
Date Issued
2019
Author(s)
Abstract
We aim to reconstruct the 3D model of solder balls on the PCB (Printed Circuit Board) according to many projections of X-ray images of those solder balls. We mainly use a tomographic reconstruction algorithm FBP (Filtered Back Projection) to obtain the cross-section of different levels without breaking the PCB and inspect their inner structure. We also optimize our execution times and compare our results with Volume Graphics.
SDGs
Type
conference paper