https://scholars.lib.ntu.edu.tw/handle/123456789/490996
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lucas, J. P. | en_US |
dc.contributor.author | Chada, S. | en_US |
dc.contributor.author | Kang, S. K. | en_US |
dc.contributor.author | Kao, C. R. | en_US |
dc.contributor.author | Lin, K. L. | en_US |
dc.contributor.author | Ready, J. | en_US |
dc.contributor.author | Yu, J. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Yu, J.;Ready, J.;Lin, K. L.;Kao, C. R.;Kang, S. K.;Chada, S.;Lucas, J. P. | - |
dc.date.accessioned | 2020-05-12T02:49:12Z | - |
dc.date.available | 2020-05-12T02:49:12Z | - |
dc.date.issued | 2003 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/490996 | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s11664-003-0100-8 | - |
dc.identifier.isi | WOS:000187885200001 | - |
dc.relation.pages | 1359-1359 | - |
dc.relation.journalvolume | 32 | - |
dc.relation.journalissue | 12 | - |
item.openairetype | journal article | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。