https://scholars.lib.ntu.edu.tw/handle/123456789/490996
Title: | Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword | Authors: | Lucas, J. P. Chada, S. Kang, S. K. Kao, C. R. Lin, K. L. Ready, J. Yu, J. C. ROBERT KAO |
Issue Date: | 2003 | Journal Volume: | 32 | Journal Issue: | 12 | Start page/Pages: | 1359-1359 | Source: | Journal of Electronic Materials | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/490996 | ISSN: | 0361-5235 | DOI: | 10.1007/s11664-003-0100-8 |
Appears in Collections: | 材料科學與工程學系 |
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