Fabrication of diamond conditioners by using a micro patterning and electroforming approach
Journal
Microelectronic Engineering
Journal Volume
103
Pages
92-98
Date Issued
2013
Author(s)
Abstract
Micro patterning and nickel electroforming, which are commonly used in MEMS process to fabricate microstructures or micro components, were employed in this study for the fabrication of diamond conditioners. The thickness of the JSR THB-151 N resist on the stainless steel substrate can reach up to 75 μm, which is sufficient for forming a mask. The diamond grits which were embedded in the nickel deposit formed microcolumns array on the substrate with the guidance of the resist mold. By using this technique, the population density of the working diamond grits in the diamond conditioner can be increased. Moreover, an extra strike nickel plating was performed to functionalize the surface of the nickel deposit for increasing the polarization of the nickel deposit which can eliminate the edge effect in the enhancement electroplating process. This fabrication process developed herein can produce diamond conditioners with improved uniformity in both distribution and protrusion control of micro column diamond cutting tips. In addition, the developed diamond conditioners exhibit an increase in material removal rate (MRR) by some 15%, while, at the same time, maintain a relatively low worn rate as compared to the commercially available conditioners.
Type
journal article