Low-dielectric constant bisbenzo(cyclobutene) and fluorinated poly(arylene)ether films as bottom anti-reflective coating layers for ArF lithography
Journal
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Journal Volume
19
Journal Issue
6
Pages
2381-2384
Date Issued
2001
Author(s)
Abstract
In this article, we demonstrate a bottom anti-reflective coating (BARC) layer for ArF lithography. The anti-reflective layers are composed of a commercial low-dielectric constant bisbenzo(cyclobutene) (BCB)- and fluorinated poly(arylene)ether (FLARE)-based films. By adding an optimized etching hard-mask layer, reflectance of less than 1% at the resist/silicon substrate interface can be achieved. BCB and FLARE also have great potential to be used as BARC layers on highly reflective substrates for metal interconnect applications. It is easy to reduce reflectance without adding an extra BARC layer for patterning low-dielectric materials. It is convenient to use this BARC structure in ArF lithography. In this article, suitable etching characteristics and thermal stability of BCB- and FLARE-based BARC layers are also described.
Type
journal article