A study of Sn-Bi-Ag-(In) lead-free solders

Journal

Journal of Materials Science

Journal Volume

38

Journal Issue

6

Pages

1269-1279

Date Issued

2003

Author(s)

Shiue, R.-K.

Tsay, L.-W.

Lin, C.-L.

Ou, J.-L.

DOI

10.1023/A:1022822127193

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491907

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0037444778&doi=10.1023%2fA%3a1022822127193&partnerID=40&md5=2cd6db8a469a1363156d3f405a8b4445

Type

journal article