Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires

Journal

Journal of Electronic Materials

Journal Volume

42

Journal Issue

3

Pages

545-551

Date Issued

2013

Author(s)

Chuang, T.-H.

Wang, H.-C.

Chuang, C.-H.

Lee, J.-D.

Tsai, H.-H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-012-2381-2

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491980

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84878478411&doi=10.1007%2fs11664-012-2381-2&partnerID=40&md5=b2705d3b1aa56d83e43074a2c6c31084

Type

journal article