Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packages

Journal

Journal of Electronic Materials

Journal Volume

38

Journal Issue

12

Pages

2762-2769

Date Issued

2009

Author(s)

Chuang, T.-H.

Cheng, C.-Y.

Chang, T.-C.

TUNG-HAN CHUANG

DOI

10.1007/s11664-009-0912-2

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491991

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-72549107357&doi=10.1007%2fs11664-009-0912-2&partnerID=40&md5=29af2a2179d834864575b5fde8c93f09

Type

journal article