Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending test
Journal
2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
Pages
121-124
Date Issued
2008
Author(s)
Cheng, C.-Y.
Zhan, C.-J.
Chuang, T.-H.
TUNG-HAN CHUANG
Type
conference paper