Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler
Journal
Journal of Materials Engineering and Performance
Journal Volume
12
Journal Issue
4
Pages
383-389
Date Issued
2003
Author(s)
Abstract
Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investigated. Electron probe microanalyzer (EPMA) analyses reveal that the element oxygen distributes uniformly within the solder matrix after soldering, while Ti segregates effectively at the ITO/soIder and Cu/solder interfaces at such a low temperature, giving satisfactory joining results of Cu/Cu, ITO/ITO, and ITO/Cu in air.
Type
journal article