Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates

Journal

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Journal Volume

93

Journal Issue

2

Pages

95-98

Date Issued

2002

Author(s)

Chan, Y.C.

Chiu, M.Y.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.3139/146.020095

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492036

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036471978&doi=10.3139%2f146.020095&partnerID=40&md5=7e6145b31e376a2ff82849af5341c48c

Type

journal article