AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging
Journal
Journal of Electronic Materials
Journal Volume
30
Journal Issue
8
Pages
945-950
Date Issued
2001
Author(s)
Abstract
The interfacial reaction between liquid In-49Sn solders and Ag substrates results in the formation of a thicker Ag2In intermetallic compound accompanied with the development of a thin AgIn2 layer. Through further aging of the In-49Sn/Ag soldered specimens at various temperatures ranging from room to 100°C, solid/solid transitions between Ag2In and AgIn2 intermetallic compounds can be observed. When the temperature drops below 75°C, Ag2In will react with the In-49Sn solder to form the dominant AgIn2 phase. Conversely, AgIn2 is consumed at a higher temperature (e.g., 100°C) when reacting with the Ag substrate to create a now dominant Ag2In phase. Lastly, the different mechanical, electrical, magnetic, and corrosion behaviours of both intermetallic compounds are respectively made known through direct measurements of the material properties of the individual Ag2In and AgIn2 bulk samples.
Type
journal article