Interfacial reactions between In10Ag solders and Ag substrates
Journal
Journal of Electronic Materials
Journal Volume
29
Journal Issue
11
Pages
1328-1332
Date Issued
2000
Author(s)
Abstract
The morphology and growth kinetics of intermetallic compounds formed during the reaction of liquid In10Ag on Ag substrates in the temperature range between 250 °C and 375 °C are studied. The results indicate that the Ag2In intermetallic compounds that appear at the interface are in the columnar shape, enveloped by thin AgIn2 shells. The growth kinetics of intermetallic compounds are parabolic, indicating that the reaction is diffusion-controlled. The Arrhenius reaction activation energy was found to be 44.9 kJ/mol. Also, the wetting behavior of the In10Ag on Ag substrates was studied. The results show that there exists a transient plateau of the contact angle variation. Such a phenomenon can be explained by the intermetallic compound precursor halo formation preceding the edge of the solder drop.
Type
journal article