Interfacial reactions between liquid indium and silver substrates
Journal
Journal of Electronic Materials
Journal Volume
29
Journal Issue
8
Pages
1047-1051
Date Issued
2000
Author(s)
Abstract
The morphology and growth kinetics of intermetallic compounds formed at the interface between liquid indium and silver substrates in the temperature range from 473 K to 673 K were studied. Electron microprobe (EPMA) analysis and x-ray diffraction (XRD) revealed that the intermetallic compound Ag2In formed as scallops. The growth followed parabolic kinetics, suggesting that the growth was diffusion-controlled. Moreover, the activation energy calculated from the Arrhenius plot of growth reaction constants was 41.55 KJ/mole. Also, the relationship between the wettability of liquid indium on the surface of silver substrates and their interfacial reactions was clarified.
SDGs
Type
journal article