Optimal wiring topology for electromigration avoidance considering multiple layers and obstacles

Journal

Proceedings of the International Symposium on Physical Design

Pages

177-184

Date Issued

2010

Author(s)

Jiang, I.H.-R.

Chang, H.-Y.

Chang, C.-L.

DOI

10.1145/1735023.1735064

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/497934

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-77952279590&doi=10.1145%2f1735023.1735064&partnerID=40&md5=2f4300b544c929db3b3df01b8cd04b71

Type

conference paper