https://scholars.lib.ntu.edu.tw/handle/123456789/497943
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Tsai, C.-C. | en_US |
dc.contributor.author | Shi, Y. | en_US |
dc.contributor.author | Luo, G. | en_US |
dc.contributor.author | HUI-RU JIANG | en_US |
dc.date.accessioned | 2020-06-11T06:12:56Z | - |
dc.date.available | 2020-06-11T06:12:56Z | - |
dc.date.issued | 2013 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/497943 | - |
dc.relation.ispartof | Proceedings of the International Symposium on Physical Design | - |
dc.title | FF-bond: Multi-bit flip-flop bonding at placement | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1145/2451916.2451955 | - |
dc.identifier.scopus | 2-s2.0-84875825605 | - |
dc.identifier.url | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84875825605&doi=10.1145%2f2451916.2451955&partnerID=40&md5=d5b521f914d4c7c84052cb8b58ef2c46 | - |
dc.relation.pages | 147-153 | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
crisitem.author.dept | Electrical Engineering | - |
crisitem.author.dept | Electronics Engineering | - |
crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
顯示於: | 電機工程學系 |
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