A 2.4-GHz radio front end in RF system-on-package technology
Journal
IEEE Microwave Magazine
Journal Volume
3
Journal Issue
2
Date Issued
2002
Author(s)
Chakraborty, S.
Lim, K.
Sutono, A.
Chen, E.
Yoo, S.
Obatoyinbo, A.
Yoon, S.-W.
Maeng, M.
Davis, M.F.
Pinel, S.
Laskar, J.
Abstract
The choice of proper radio architecture and sharing of ground plane among LTCC passive components enables compact implementation of the RF front end. In fact, most of the current wireless LAN solutions aim for very low intermediate frequency (VLIF) radio frequency (RF) architectures for better integration of integrated circuits (ICs) in commonly available semiconductor processes. This paper presents the development of complimentary metal-oxide-semiconductor (CMOS) monolithic microwave integrated circuits (MMICs) and LTCC multilayer passive components.
SDGs
Type
journal article