TSV-aware analytical placement for 3D IC designs.

Journal

Proceedings of the 48th Design Automation Conference, DAC 2011, San Diego, California, USA, June 5-10, 2011

Pages

664-669

Date Issued

2011

Author(s)

Hsu, Meng-Kai

Chang, Yao-Wen

Balabanov, Valeriy

DOI

URI

URL

Type

conference paper