https://scholars.lib.ntu.edu.tw/handle/123456789/501997| Title: | TSV-aware analytical placement for 3D IC designs. | Authors: | Hsu, Meng-Kai Chang, Yao-Wen Balabanov, Valeriy YAO-WEN CHANG |
Issue Date: | 2011 | Start page/Pages: | 664-669 | Source: | Proceedings of the 48th Design Automation Conference, DAC 2011, San Diego, California, USA, June 5-10, 2011 | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/501997 | DOI: | 10.1145/2024724.2024875 |
| Appears in Collections: | 電信工程學研究所 |
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