Chip Last Fan-Out Packaging for Millimeter Wave Application

Journal

Proceedings - Electronic Components and Technology Conference

Journal Volume

2016-August

Pages

1303-1308

Date Issued

2016

Author(s)

Lu, H.-C.

Wang, Y.-H.

Leou, J.-L.

Chan, H.

Chen, S.

DOI

10.1109/ECTC.2016.197

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/502215

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84987829364&doi=10.1109%2fECTC.2016.197&partnerID=40&md5=70efb04504f57f91cb4ec6666a6e4070

Type

conference paper