Thermal modeling and device oise properties of three-dimensional-SOI technology

Journal

IEEE Transactions on Electron Devices

Journal Volume

56

Journal Issue

4

Pages

656-664

Date Issued

2009

Author(s)

Chen, T.W.

Chun, J.-H.

Lu, Y.-C.

Navid, R.

Wang, W.

Chen, C.-L.

Dutton, R.W.

DOI

10.1109/TED.2009.2014188

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/502245

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-65449176025&doi=10.1109%2fTED.2009.2014188&partnerID=40&md5=eb0eba23f5f121b07ad8dd4f268c5bf0

Type

journal article