Phase stabilities and interfacial reactions of the Cu�VIn binary systems

Journal

Journal of Materials Science: Materials in Electronics

Journal Volume

31

Journal Issue

13

Pages

10161-10169

Date Issued

2020

Author(s)

Lin, Y.F.

Hung, H.T.

Yu, H.Y.

Kao, C.R.

Wang, Y.W.

DOI

10.1007/s10854-020-03561-x

URI

https://www.scopus.com/inward/record.url?eid=2-s2.0-85084677300&partnerID=40&md5=fd129ee82c094c5739e8e35c9da147a8

https://scholars.lib.ntu.edu.tw/handle/123456789/546624

Type

journal article