https://scholars.lib.ntu.edu.tw/handle/123456789/547538
標題: | Slicing ceramics on material removed by a single abrasive particle | 作者: | Tsai, Y.-Y. Wu, M.-C. Liao, Y.-S. Tsao, C.-C. Hsu, C.-Y. YUNN-SHIUAN LIAO YAO-YANG TSAI |
關鍵字: | Brittle fracture; Material removal processing; Plastic deformation; Wire-saw machining | 公開日期: | 2020 | 卷: | 13 | 期: | 19 | 起(迄)頁: | 1-13 | 來源出版物: | Materials | 摘要: | Multi-wire saw machining (MWSM) used for slicing hard-brittle materials in the semiconductor and photovoltaic industries is an important and efficient material removal process that uses free abrasives. The cutting model of single-wire saw machining (SWSM) is the basis of MWSM. The material removal mechanism of SWSM is more easily understood than MWSM. A mathematical model (includes brittle fracture and plastic deformation) is presented in this paper for SWSM ceramic with abrasives. This paper determines the effect of various machining parameters on the removal of hard-brittle materials. For brittle fracture of SWSM ceramics, the minimum strain energy density is used as a fracture criterion. For plastic deformation of SWSM ceramics, the material removal is calculated using equations of motion. Actual wire-sawing experiments are conducted to verify the results of the developed mathematical model. The theoretical results agree with experimental data and practical experience. From the developed mathematical model, brittle fracture plays a major role in material removal of SWSM ceramics. Wire speed (S) and working load (P) are positively correlated with material removal of SWSM ceramics. The coefficient of friction is low, a lateral crack, which propagates almost parallel to the working surface, leads to more brittle fracture and material removal is increased. © 2020 by the authors. Licensee MDPI, Basel, Switzerland. |
URI: | https://www.scopus.com/inward/record.url?eid=2-s2.0-85093970840&partnerID=40&md5=606dd4275dabeb096820ac6c46a001bf https://scholars.lib.ntu.edu.tw/handle/123456789/547538 |
ISSN: | Tsai, Y.-Y.;Wu, M.-C.;Liao, Y.-S.;Tsao, C.-C.;Hsu, C.-Y. | DOI: | 10.3390/ma13194324 | SDG/關鍵字: | Abrasives; Brittle fracture; Brittleness; Equations of motion; Friction; Plastic deformation; Sawing; Strain energy; Coefficient of frictions; Hard brittle materials; Machining parameters; Material removal mechanisms; Material removal process; Photovoltaic industry; Practical experience; Strain energy density; Wire |
顯示於: | 機械工程學系 |
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