https://scholars.lib.ntu.edu.tw/handle/123456789/576950
標題: | Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned films | 作者: | Lai Y.-C Wu P.-C Chuang T.-H. TUNG-HAN CHUANG |
關鍵字: | High resolution transmission electron microscopy; Ion beams; Temperature; Three dimensional integrated circuits; 3-D ICs; Ag$++$; Ag[sbnd]ag direct bonding; Interfacial structures; Low temperature bonding; Low temperature direct bonding; Nanotwins; Preferred orientations; Si substrates; Thermal; Thermodynamic stability | 公開日期: | 2021 | 卷: | 175 | 來源出版物: | Materials Characterization | 摘要: | In this study, low-temperature Ag[sbnd]Ag direct bonding was achieved at 150–250 °C in 10–60 min by using high (111)-preferred orientation films with densely-packed nanotwins fabricated by magnetron sputtering process. The focused ion beam (FIB) and transmission electron microscopy (TEM) results showed great bonding interfaces with almost no voids. The top-view electron backscattered diffraction (EBSD) results indicated that the grains on the surface before bonding were almost 100% (98.4%) (111)-preferred orientation grains, which provided a rapid path for diffusion. High thermal stability was observed, for the twin thickness remained unchanged after bonding at various temperatures. The bonding technique shows great potential for application in MEMS, optoelectronics, transducers, heat-sensitive components and 3D IC interconnections. ? 2021 Elsevier Inc. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85103318184&doi=10.1016%2fj.matchar.2021.111060&partnerID=40&md5=2ad6a8ed4029884f6243bb19bf362f37 https://scholars.lib.ntu.edu.tw/handle/123456789/576950 |
ISSN: | 10445803 | DOI: | 10.1016/j.matchar.2021.111060 |
顯示於: | 材料科學與工程學系 |
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