https://scholars.lib.ntu.edu.tw/handle/123456789/581459
標題: | Overheating-Avoidance Remapping Scheme for Reliability Enhancement of 3D PCM Storage Systems | 作者: | Lin Y.-C Wang T.-Y Tsao C.-W Chang Y.-H Chen J.-J Liu X TEI-WEI KUO |
關鍵字: | 3D phase change memory; lifetime; temperature | 公開日期: | 2020 | 起(迄)頁: | 239-246 | 來源出版物: | ACM International Conference Proceeding Series | 摘要: | With the trend of 3D architecture and higher access rate, Phase Change Memory (PCM) storage devices face the overheating issue. This work is motivated by the observation that PCM devices might change states of memory cells with high temperature, and it will hurt the reliability of 3D PCM storage systems. Hence, we propose an Overheating-Avoidance Remapping Scheme (OARS) that controls the temperature of PCM layers and achieves wear-leveling of PCM cells inside PCM devices. Besides, we also take remapping overhead into consideration. The experiments were conducted based on the representative realistic workloads, and the results demonstrate the efficacy of the proposed scheme. ? 2020 ACM. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85097394749&doi=10.1145%2f3400286.3418248&partnerID=40&md5=d2c3234887b60a8e6a4cafcf2495762a https://scholars.lib.ntu.edu.tw/handle/123456789/581459 |
DOI: | 10.1145/3400286.3418248 | SDG/關鍵字: | Virtual storage; 3D architectures; Access rates; High temperature; Memory cell; Phase change memory (pcm); Reliability enhancement; Storage systems; Wear leveling; Phase change memory |
顯示於: | 資訊工程學系 |
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