Study on CMP Process of Glass Wafers with SiO2 Based Slurry

Journal

ISSAT International Conference Reliability and Quality in Design

Date Issued

2015

Author(s)

Chen, C.C.

Young, H.T.

Chiou, C.H.

Xue, M.Y.

Pan C.L.

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/587638

Description

Philadelphia, Pennsylvania, U.S.A.

Type

conference paper