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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Innovative through-silicon-via formation approach for wafer-level packaging applications
Details
Innovative through-silicon-via formation approach for wafer-level packaging applications
Journal
J. Micromech. Microeng.
Journal Volume
22
Journal Issue
045019
Pages
1-8
Date Issued
2012
Author(s)
Chao-Wei Tang
Hong-Tsu Young
Kuan-Ming Li
HONG-TSU YOUNG
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/587661
Type
journal article
