https://scholars.lib.ntu.edu.tw/handle/123456789/587665
Title: | Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process | Authors: | Chao-Wei Tang Hong-Tsu Young Kuan-Ming Li Shih-Chieh Tseng HONG-TSU YOUNG |
Issue Date: | 2012 | Journal Issue: | s0026 | Start page/Pages: | 1-5 | Source: | International Conference on Advanced Manufacturing | Description: | Jiaoxi |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/587665 |
Appears in Collections: | 機械工程學系 |
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