Temperature Sensor Array Using Flexible Substrate
Journal
IEEE MEMS 2007
Pages
589-592
Date Issued
2007
Author(s)
Abstract
This paper presents the design, fabrication and measurement results of a flexible temperature sensor array based on MEMS technology. The temperature sensor array is composed of 256 (16times16) sensors inside a 28times20 mm 2 area. Using a polyimide (PI) thin film (35 mum) with a copper layer (40 mum) on one side as the starting material, a double-sided fabrication process is applied to create the sensing elements as well as the interconnects for scanning circuitry. As the resistance of platinum changes with temperature, the corresponding temperature can be obtained by measuring the resistance of each element in the temperature sensing array.
SDGs
Description
Kobe, Japan
Type
conference paper