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College of Engineering / 工學院
Civil Engineering / 土木工程學系
Multiscale Modeling of Strength and Toughness of 3D IC Intermetallic Micro Bumps
Details
Multiscale Modeling of Strength and Toughness of 3D IC Intermetallic Micro Bumps
Journal
13th U.S. National Congress on Computational Mechanics
Date Issued
2015
Author(s)
C-H Yu
C-C Lin
C-S Chen
CHUIN-SHAN CHEN
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/591136
Type
conference paper