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  4. Vacuum Brazing of Metallized YSZ and Crofer Alloy Using 72Ag-28Cu Filler Foil
 
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Vacuum Brazing of Metallized YSZ and Crofer Alloy Using 72Ag-28Cu Filler Foil

Journal
Materials
Journal Volume
15
Journal Issue
3
Date Issued
2022
Author(s)
Huang L.-W
Shiue R.-K
Liu C.-K
Cheng Y.-N
Lee R.-Y
Tsay L.-W.
REN-KAE SHIUE  
DOI
10.3390/ma15030939
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85123686437&doi=10.3390%2fma15030939&partnerID=40&md5=b748eb3532bf4389e72f859185040dc9
https://scholars.lib.ntu.edu.tw/handle/123456789/598427
Abstract
The study focused on dissimilar brazing of metallized YSZ (Yttria-Stabilized Zirconia) and Crofer alloy using BAg-8 (72Ag-28Cu, wt%) filler foil. The YSZ substrate was metallized by sequentially sputtering Ti (0.5/1 μm), Cu (1/3 μm), and Ag (1.5/5 μm) layers, and the Crofer substrate was coated with Ag layers with a thickness of 1.5 and 5 μm, respectively. The BAg-8 filler demonstrated excellent wettability on both metallized YSZ and Crofer substrates. The brazed joint primarily consisted of Ag-Cu eutectic. The metallized Ti layer dissolved into the braze melt, and the Ti preferentially reacted with YSZ and Fe from the Crofer substrate. The globular Fe2Ti intermetallic compound was observed on the YSZ side of the joint. The interfacial reaction of Ti was increased when the thickness of the metallized Ti layer was increased from 0.5 to 1 μm. Both brazed joints were crack free, and no pressure drop was detected after testing at room temperature for 24 h. In the YSZ/Ti(0.5μ)/Cu(1μ)/Ag(1.5μ)/BAg-8(50μ)/Ag(1.5μ)/Crofer joint tested at 600 °C, the pressure of helium decreased from 2.01 to 1.91 psig. In contrast, the helium pressure of the YSZ/Ti(1μ)/Cu(3μ)/Ag(5μ)/BAg-8(50μ)/Ag(5μ)/Crofer joint slightly decreased from 2.02 to 1.98 psig during the cooling cycle of the test. The greater interfacial reaction between the metallized YSZ and BAg-8 filler due to the thicker metallized Ti layer on the YSZ substrate was responsible for the improved gas-tight performance of the joint. ? 2022 by the authors.
Subjects
Gas-tight
Interfacial reaction
Metallization
Vacuum brazing
Binary alloys
Copper alloys
Fillers
Helium
Metallizing
Silver alloys
Substrates
Titanium
Titanium alloys
Yttrium oxide
Ag layers
Brazed joint
Cooling cycle
Crack free
Helium pressure
Intermetallics compounds
Metallisation
Yttria-stabilized-zirconia
Zirconia substrates
Yttria stabilized zirconia
Type
journal article

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