Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
Journal
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Journal Volume
53
Journal Issue
1
Pages
136-146
Date Issued
2022
Author(s)
Abstract
Zn4Sb3 has received interest for thermoelectric (TE) applications due to its low cost and low environmental impact. In this study, the Zn4Sb3 TE material was diffusion-bonded with multiple electrode materials of Ni, Ag, Cu, Pd and Ti for evaluation of the manufacturing of TE modules. Intermetallic compounds formed at the interfaces of the Zn4Sb3 diffusion couples, with Ni, Ag, Cu, and Pd exhibiting the selective reaction effect with zinc due to its high chemical affinity and low formation energies. Optimized bonding strengths of 6.6 to 8.2?MPa were achieved in Zn4Sb3 bonded with Ni, Ag and Cu materials at 350?°C. The Pd material could only bond at a temperature above 300?°C, and cracks presented after longer bonding times. As for the titanium, Zn4Sb3/Ti was successfully joined only at temperatures between 400?°C and 500?°C. It was observed that a rather thin TiSb2 intermetallic compound formed during the interfacial reactions between Zn4Sb3 and Ti, which grew significantly more slowly than those formed at the interfaces of Zn4Sb3 diffusion-coupled with Ni, Ag, Cu, and Pd metallic materials. Our results provide a reference for evaluating these common materials as suitable electrode and barrier layer candidates for utilizing the Zn4Sb3 TE material. ? 2021, The Minerals, Metals & Materials Society and ASM International.
Subjects
Antimony compounds
Diffusion
Electrodes
Environmental impact
Interfaces (materials)
Intermetallics
Nickel compounds
Palladium
Silver compounds
Titanium compounds
Be-diffusion
Electrode material
Intermetallic growth
Intermetallics compounds
Low-costs
Metallic electrodes
Multiple electrodes
Thermo-Electric materials
Thermoelectric application
Thermoelectric material
Zinc compounds
Type
journal article