https://scholars.lib.ntu.edu.tw/handle/123456789/598494
標題: | Bonding microwave absorbing ferrites to thermal conducting copper | 作者: | Chen G.-R Tuan W.-H. WEI-HSING TUAN |
關鍵字: | Copper alloys;Copper metallurgy;Ferrite;Ferrites;Thermal expansion;Copper ferrites;Heat spreading;Metallic copper;Microstructure observation;Microwave absorbing;Spinel ferrites;Thermal characteristics;Thermal expansion coefficients;Thermal conductivity | 公開日期: | 2022 | 卷: | 19 | 期: | 2 | 起(迄)頁: | 1001-1008 | 來源出版物: | International Journal of Applied Ceramic Technology | 摘要: | In the present study, the thermal characteristics of spinel ferrites are reported. The thermal expansion coefficient of ferrites is slightly larger than that of silicon; furthermore, these ferrites all demonstrate capability to absorb microwave. Nevertheless, their thermal conductivity is relatively low. A copper plate is bonded to ferrite to provide a backing for heat spreading. Microstructure observation at the interface reveals no reaction phase. The thermal resistance at the copper-ferrite interface is low. With the bonding of metallic copper, the heat generated in ferrites by microwave absorbing is possible to be removed by the backing copper layer. ? 2021 The American Ceramic Society (ACERS) |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85113299597&doi=10.1111%2fijac.13859&partnerID=40&md5=4b94225ada31557cddb59ded764ab67a https://scholars.lib.ntu.edu.tw/handle/123456789/598494 |
ISSN: | 1546542X | DOI: | 10.1111/ijac.13859 |
顯示於: | 材料科學與工程學系 |
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