Bonding microwave absorbing ferrites to thermal conducting copper
Journal
International Journal of Applied Ceramic Technology
Journal Volume
19
Journal Issue
2
Pages
1001-1008
Date Issued
2022
Author(s)
Abstract
In the present study, the thermal characteristics of spinel ferrites are reported. The thermal expansion coefficient of ferrites is slightly larger than that of silicon; furthermore, these ferrites all demonstrate capability to absorb microwave. Nevertheless, their thermal conductivity is relatively low. A copper plate is bonded to ferrite to provide a backing for heat spreading. Microstructure observation at the interface reveals no reaction phase. The thermal resistance at the copper-ferrite interface is low. With the bonding of metallic copper, the heat generated in ferrites by microwave absorbing is possible to be removed by the backing copper layer. ? 2021 The American Ceramic Society (ACERS)
Subjects
Copper alloys
Copper metallurgy
Ferrite
Ferrites
Thermal expansion
Copper ferrites
Heat spreading
Metallic copper
Microstructure observation
Microwave absorbing
Spinel ferrites
Thermal characteristics
Thermal expansion coefficients
Thermal conductivity
Type
journal article