2D Materials-Based Static Random-Access Memory
Journal
Advanced Materials
Date Issued
2022
Author(s)
Abstract
2D transition-metal dichalcogenide semiconductors, such as MoS2 and WSe2, with adequate bandgaps are promising channel materials for ultrascaled logic transistors. This scalability study of 2D material (2DM)-based field-effect transistor (FET) and static random-access memory (SRAM) cells analyzing the impact of layer thickness reveals that the monolayer 2DM FET with superior electrostatics is beneficial for its ability to mitigate the read–write conflict in an SRAM cell at scaled technology nodes (1–2.1?nm). Moreover, the monolayer 2DM SRAM exhibits lower cell read access time and write time than the bilayer and trilayer 2DM SRAM cells at fixed leakage power. This simulation predicts that the optimization of 2DM SRAM designed with state-of-the-art contact resistance, mobility, and equivalent oxide thickness leads to excellent stability and operation speed at the 1-nm node. Applying the nanosheet (NS) gate-all-around (GAA) structure to 2DM further reduces cell read access time and write time and improves the area density of the SRAM cells, demonstrating a feasible scaling path beyond Si technology using 2DM NSFETs. In addition to the device design, the process challenges for 2DM NSFETs, including the cost-effective stacking of 2DM layers, formation of electrical contacts, suspended 2DM channels, and GAA structures, are also discussed. ? 2022 Wiley-VCH GmbH
Subjects
Cells
Cost effectiveness
Cytology
Field effect transistors
Layered semiconductors
Molybdenum compounds
Selenium compounds
Static random access storage
Transition metals
Tungsten compounds
Channel materials
Field-effect transistor
Gate-all-around
Layer thickness
Material-based
Random access
Read access time
Scaled technologies
Static random access memory
Transition metal dichalcogenides (TMD)
Monolayers
Type
journal article