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  4. Modeling and performance evaluation of a controlled IC fab using distributed colored timed Petri net
 
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Modeling and performance evaluation of a controlled IC fab using distributed colored timed Petri net

Journal
Proceedings - IEEE International Conference on Robotics and Automation
Journal Volume
3
Pages
2191-2196
Date Issued
2000
Author(s)
Kuo Chung-Hsien
Huang Han-Pang
CHUNG-HSIEN KUO  
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-0033692345&partnerID=40&md5=62e48bef17da92abd527dd72eef6d40a
https://scholars.lib.ntu.edu.tw/handle/123456789/611653
Abstract
This paper proposes the modeling and performance evaluation of a controlled IC foundry fab using a distributed colored timed Petri net (DCTPN). A DCTPN is designed for highly model-mixed and flexible routing manufacturing systems. The distributed models can be integrated through communication places, and the manufacturing execution system (MES) can be executed using a COM (component object model) server place. Especially, the process activities of a general IC foundry tools are analyzed, modeled and grouped into a basic tool model library. Based on the tool model library, an entire fab model can be constructed. The DCTPN-based fab model can act as a virtual fab, and be used to estimate fab performance and fab behaviors. In addition, the DCTPN conflict resolution and token competition rules are used to control a fab. Finally, a simplified 200mm IC fab is presented and its system performance, including throughput, stage move, WIP (wafer in process) distribution, lot cycle time, utilization, is evaluated. The operation histories of tools and lots are also included. The entire fab model has been verified in a real IC foundry fab.
Subjects
Component object model
Distributed colored timed Petri net
Integrated circuit foundry fab
Lot cycle time
Manufacturing execution system
Tool model library
Wafer in process
Chemical vapor deposition
Diffusion
Etching
Fabrication
Integrated control
Ion implantation
Oxidation
Petri nets
Photoresists
Automation
Type
conference paper

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