https://scholars.lib.ntu.edu.tw/handle/123456789/625235
標題: | The Role of Cross-Linkers in the Mechanical Responses of Gold Nanoparticle Assemblies | 作者: | Yeh K.-C Tsai Y.-Y SHU-WEI CHANG |
公開日期: | 2022 | 卷: | 126 | 期: | 14 | 起(迄)頁: | 6456-6464 | 來源出版物: | Journal of Physical Chemistry C | 摘要: | Nanoparticle assemblies have incredible flexibility and tunable electrical and mechanical properties. Thin films containing gold nanoparticles (GNPs) are among the best candidates for various applications, such as touch sensors, strain gauges, and vapor sensors. Recently, covalently cross-linked GNP thin films with enhanced electrical properties and mechanical stability were fabricated by layer-by-layer spin-coating. Researchers found experimentally that the elastic modulus of such films can be tuned in the range of 3.6-10 GPa by controlling the core size, degree of order, ligand length, and so forth. However, few molecular studies have illuminated the molecular mechanisms of cross-linked NP thin films. Here, we demonstrated direct atomistic modeling of alkanedithiol cross-linked GNP thin films and probed the mechanical properties by tensile test simulations. We showed that the Young's modulus values obtained from our models are consistent with the experimental results. We also revealed that the mechanical properties of thin films depended on the ligand length, core size, and grafting density. Our results showed that the number of all-trans bridge linkers dominates the Young's modulus of the thin films. This study provides molecular insights into the role of cross-linkers in the mechanical responses of GNP assemblies and provides fundamental information for the design of thin films, which could benefit many applications. © 2022 American Chemical Society. All rights reserved. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85127898444&doi=10.1021%2facs.jpcc.2c00630&partnerID=40&md5=c55c85d17bf676ef2b46956b08955ddd https://scholars.lib.ntu.edu.tw/handle/123456789/625235 |
ISSN: | 19327447 | DOI: | 10.1021/acs.jpcc.2c00630 | SDG/關鍵字: | Density (specific gravity); Elastic moduli; Gold nanoparticles; Ligands; Mechanical stability; Mechanisms; Metal nanoparticles; Tensile testing; Core size; Crosslinker; Electrical and mechanical properties; Mechanical response; Nanoparticle assemblies; Strain gage sensors; Thin-films; Tunables; Vapour sensors; Young modulus; Thin films |
顯示於: | 土木工程學系 |
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