|Title:||Additive-induced crystallization of highly (111) textured Cu nanotwins by electroless deposition||Authors:||Shih, P. S.
Huang, C. H.
C. ROBERT KAO
|Keywords:||Electroless plating | Nanotwinned Cu | Preferred orientation||Issue Date:||5-Oct-2023||Journal Volume:||958||Source:||Journal of Alloys and Compounds||Abstract:||
High-density Cu nanotwins in columnar grains were successfully fabricated within an electroless-deposited Cu film using a formaldehyde-based electroless plating solution. Such a structure was achieved by using a standard electroless plating process without high-speed stirring. Additives within the plating bath induced the crystallization of the nanotwinned structure in the reduced Cu atoms. In addition, the deposited Cu nanotwins comprised as high as 87% of the (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process indicate that this method is promising for future applications in the electronics industry.
|Appears in Collections:||材料科學與工程學系|
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