|Title:||Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling||Authors:||Chang, Fu Ling
Lin, Yu Hsin
Hung, Han Tang
Kao, Chen Wei
C. ROBERT KAO
|Keywords:||Cu-In-Sn intermetallic compounds | interconnection | interfacial reaction | low-temperature soldering | mechanical properties||Issue Date:||1-May-2023||Journal Volume:||16||Journal Issue:||9||Source:||Materials||Abstract:||
Eutectic In-48Sn was considered a promising candidate for low-temperature solder due to its low melting point and excellent mechanical properties. Both Cu2(In,Sn) and Cu(In,Sn)2 formation were observed at the In-48Sn/Cu interface after 160 °C soldering. However, traditional mechanical polishing produces many defects at the In-48Sn/Cu interface, which may affect the accuracy of interfacial reaction investigations. In this study, cryogenic broad Ar+ beam ion milling was used to investigate the interfacial reaction between In-48Sn and Cu during soldering. The phase Cu6(Sn,In)5 was confirmed as the only intermetallic compound formed during 150 °C soldering, while Cu(In,Sn)2 formation was proven to be caused by room-temperature aging after soldering. Both the Cu6(Sn,In)5 and Cu(In,Sn)2 phases were confirmed by EPMA quantitative analysis and TEM selected area electron diffraction. The microstructure evolution and growth mechanism of Cu6(Sn,In)5 during soldering were proposed. In addition, the Young’s modulus and hardness of Cu6(Sn,In)5 were determined to be 119.04 ± 3.94 GPa and 6.28 ± 0.13 GPa, respectively, suggesting that the doping of In in Cu6(Sn,In)5 has almost no effect on Young’s modulus and hardness.
|Appears in Collections:||材料科學與工程學系|
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.