https://scholars.lib.ntu.edu.tw/handle/123456789/632182
標題: | A Hybrid Integration Platform of Silicon Photonics | 作者: | CHIEN-CHUNG LIN Huang C.-Y Ku K.-N Chou K.-W Chen T.-H Chang P.-C Chen Y.-F Lin C.-Y Wang C.-C Lee C.-S Hsu C.-H Chen S.-C. |
關鍵字: | fiber array couplers; full-wafer measurement; high speed modulator; high speed photodetector; laser sub-assembly; photonic package; silicon photonics | 公開日期: | 2020 | 來源出版物: | 25th Opto-Electronics and Communications Conference, OECC 2020 | 摘要: | In this paper, we demonstrated the hybrid silicon photonics platform developed in ITRI. The functions of this platform include full-wafer high speed photonic measurement, active and passive device fabrication, and the photonic packaging technology. © 2020 IEEE. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85098708135&doi=10.1109%2fOECC48412.2020.9273651&partnerID=40&md5=26c6984a0c6581b91ae9fc4dc00f83d3 https://scholars.lib.ntu.edu.tw/handle/123456789/632182 |
DOI: | 10.1109/OECC48412.2020.9273651 | SDG/關鍵字: | Photonic devices; Silicon wafers; Active and passive device; High Speed; Hybrid integration; Photonic packaging; Silicon photonics |
顯示於: | 電機工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。