A Hybrid Integration Platform of Silicon Photonics
Journal
25th Opto-Electronics and Communications Conference, OECC 2020
Date Issued
2020
Author(s)
Huang C.-Y
Ku K.-N
Chou K.-W
Chen T.-H
Chang P.-C
Chen Y.-F
Lin C.-Y
Wang C.-C
Lee C.-S
Hsu C.-H
Chen S.-C.
Abstract
In this paper, we demonstrated the hybrid silicon photonics platform developed in ITRI. The functions of this platform include full-wafer high speed photonic measurement, active and passive device fabrication, and the photonic packaging technology. © 2020 IEEE.
Subjects
fiber array couplers; full-wafer measurement; high speed modulator; high speed photodetector; laser sub-assembly; photonic package; silicon photonics
SDGs
Other Subjects
Photonic devices; Silicon wafers; Active and passive device; High Speed; Hybrid integration; Photonic packaging; Silicon photonics
Type
conference paper