Formation Mechanism of high Ni content (Cu, Ni)6Sn5in Cu/Sn/Ni microbump for solid state aging
Journal
Proceedings of 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022
ISBN
9781665492690
Date Issued
2022-01-01
Author(s)
Yu, Haiyang
Abstract
Due to its low cost, the Cu/Sn/Ni microbump is the most widely used structure in electronic packaging. Recent studies have characterized the evolution of the microstructure and phase formation in this system, and a unique (Cu,Ni)6Sn5 phase has been discovered with a high Ni content. However, there has been debate over the formation mechanism of this phase. This study builds a model of the formation mechanism of (Cu,Ni)6Sn5 and provides direct proof.
Subjects
(Cu,Ni) Sn 6 5 | formation mechanism | microbump
Type
conference paper