https://scholars.lib.ntu.edu.tw/handle/123456789/632806
標題: | Formation Mechanism of high Ni content (Cu, Ni)6Sn5in Cu/Sn/Ni microbump for solid state aging | 作者: | Yu, Haiyang C. ROBERT KAO |
關鍵字: | (Cu,Ni) Sn 6 5 | formation mechanism | microbump | 公開日期: | 1-一月-2022 | 來源出版物: | Proceedings of 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022 | 摘要: | Due to its low cost, the Cu/Sn/Ni microbump is the most widely used structure in electronic packaging. Recent studies have characterized the evolution of the microstructure and phase formation in this system, and a unique (Cu,Ni)6Sn5 phase has been discovered with a high Ni content. However, there has been debate over the formation mechanism of this phase. This study builds a model of the formation mechanism of (Cu,Ni)6Sn5 and provides direct proof. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/632806 | ISBN: | 9781665492690 | DOI: | 10.1109/ICTA56932.2022.9962977 |
顯示於: | 材料科學與工程學系 |
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