Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples
Journal
Materials Chemistry and Physics
Journal Volume
111
Journal Issue
1
Start Page
17
End Page
19
ISSN
02540584
Date Issued
2008
Author(s)
Abstract
Sn-Sb and Sn-Sb-based alloys are important high temperature solders. Interfacial reactions are examined in the Sn-5.0 at% Sb/Ag and Sn-10.0 at% Sb/Ag at 200 °C, and Sn-5.0 at% Sb/Cu and Sn-10.0 at% Sb/Cu at 250 °C. Only the Ag3Sn phase is formed in the Sn-Sb/Ag couples, and Cu6Sn5 and Cu3Sn phases are formed in the Sn-Sb/Cu couples. The reaction products all grow linearly with the square root of reaction time which suggests the interfacial reactions are diffusion controlled. © 2008 Elsevier B.V. All rights reserved.
Subjects
Ag
Cu
Interfacial reactions
Sn-Sb
Type
journal article