Advanced Packaging Warpage Modeling with DeepONet-Based Operator Learning
Journal
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
Start Page
1
End Page
9
ISBN (of the container)
979-833151560-7
Date Issued
2025-11-20
Author(s)
Abstract
Warpage caused by the manufacturing thermal process can significantly reduce product yield in advanced packaging. As a result, numerical simulations such as finite element methods (FEMs) are often used to analyze warpage effects. However, constrained by the mesh generation and large matrix-solving requirements in finite element methods, optimizing for warpage can be time-consuming. This paper presents a fundamental physical model, training framework, and methodology for a warpage surrogate model based on DeepONets, a physics-informed operator learning framework. Experimental results show that our warpage model achieves an average speedup of 435X compared to traditional solvers while maintaining a minimal average warpage error of just 1.9%.
Event(s)
44th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2025
Publisher
Institute of Electrical and Electronics Engineers Inc.
Type
conference paper