Transient thermoelastic analysis in thin circular disks with shifted Gaussian heating and edge convection
Journal
Journal of Thermal Stresses
ISSN
01495739
Date Issued
2026
Author(s)
Abstract
This study develops a semi-analytical transient thermoelastic formulation for thin circular disks subjected to a radially shifted Gaussian surface heat flux, a profile highly representative of helical undulator conditions in synchrotron radiation, semiconductor processing, and laser systems. The axisymmetric transient temperature field is obtained through a Bessel eigenfunction expansion, while the in-plane stresses are evaluated under a quasi-static plane-stress assumption. In addition to characterizing transient fields with high fidelity, this formulation elucidates a physical mechanism inaccessible through local-temperature heuristics: in-plane stresses are fundamentally governed by the geometrically weighted spatial accumulation of thermal contributions. Consequently, stress extrema are systematically non-coincident with the temperature maximum and migrate inward as transient diffusion progresses. These results establish a universal and precise framework for optimizing the mechanical integrity of high-heat components in extreme thermal environments.
Subjects
Bessel eigenfunction expansion
radially shifted Gaussian heat flux
Robin boundary condition
spatially accumulated thermal analysis
thin circular disk
Publisher
Taylor and Francis Ltd.
Type
journal article