Any-Angle Die-to-Die Routing for Advanced Packages with Asymmetric Pin Row Structures, Via Constraints, and Shielding-Aware Reservation
Journal
Proceedings of the International Symposium on Physical Design
Start Page
46
End Page
54
ISBN
[9798400723148]
Date Issued
2026-03-15
Author(s)
Abstract
Die-to-die (D2D) routing in advanced packages now faces unprecedented challenges due to extremely dense signal communications, large via size, and strict requirements such as teardrops, staggered vias and full shielding. These constraints severely limit routing resources and necessitate any-angle routing to fully exploit limited space, yet this flexibility drastically increases algorithmic complexity, particularly when dies exhibit irregular, asymmetric pin rows typical in heterogeneous integration. Existing works mostly focus on die-to-substrate (D2S) routing, primarily adopt fixed-angle routing, and most importantly, they all employ sequential route methodologies. As a result, they cannot handle the tight global resource coupling and geometric irregularity of dense D2D scenarios, leading to inferior performance in modern heterogeneous package designs. This paper introduces a global, concurrent any-angle D2D routing framework that unifies routing and via planning, directly incorporates staggered via and teardrop constraints, handles arbitrary asymmetric die structures, and reserves space for full shielding. Experimental results on industrial-inspired D2D benchmarks show that our approach achieves 100% routability in dense regimes, while also accommodating full shielding, reducing total wirelength and maintaining near-linear runtime scalability. © 2026 Owner/Author.
Event(s)
35th ACM International Symposium on Physical Design, ISPD 2026
Subjects
die-to-die routing
shielding
staggered vias
teardrop
Publisher
ACM
Type
conference paper