https://scholars.lib.ntu.edu.tw/handle/123456789/75614
Title: | SnAgCu系列無鉛銲料應用於先進微電子封裝之研究 | Authors: | 高振宏 楊素純 |
Issue Date: | Jan-2006 | Journal Volume: | 89 | Journal Issue: | 1 | Start page/Pages: | 86-92 | Source: | 工程科技通訊 | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/198829 |
Appears in Collections: | 材料科學與工程學系 |
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