Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing

Resource

Acta Materialia, 60(5), 2082-2090

Journal

Acta Materialia

Pages

2082-2090

Date Issued

2012

Date

2012

Author(s)

Ke, J.H.

Chuang, H.Y.

Shih, W.L.

DOI

URI

Type

journal article

File(s)

Name

50.pdf

Size

23.44 KB

Format

Adobe PDF

Checksum

(MD5):d541ca7e0a2543a4fed3f3a183e50f18