https://scholars.lib.ntu.edu.tw/handle/123456789/75792
Title: | Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing | Authors: | Ke, J.H. Chuang, H.Y. Shih, W.L. C. ROBERT KAO |
Issue Date: | 2012 | Start page/Pages: | 2082-2090 | Source: | Acta Materialia | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/243608 | DOI: | 10.1016/j.actamat.2011.12.021 |
Appears in Collections: | 材料科學與工程學系 |
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