https://scholars.lib.ntu.edu.tw/handle/123456789/82053
標題: | 半導體產業中製程監控之取樣策略 | 作者: | 陳正剛 | 關鍵字: | 取樣策略;統計製程控制;良率改善;線上檢測;sampling strategy;SPC;yield improvement;In-line inspection | 公開日期: | 1998 | 出版社: | 臺北市:國立臺灣大學工業工程學研究所 | 摘要: | 線上檢測是半導體製程中非常重要之步驟。 由於半導體製造過程相當昂貴,一片晶圓在經過每 一步製程,其附加產值都將明顯增加。為了有效地 偵測出製程偏移以減少生產損失並改善良率,極為 關鍵的步驟便是使用線上檢測方法,一個有效率之 取樣策略將有助於使線上檢測能真正達到改善良 率的目的。然而,複雜的製造過程使線上取樣亦成 為不易之工作。在本計畫中,我們將發展出一套整 合取樣策略。我們尤其將重點放在提昇統計製程管 制圖 (statistical process control charts) 和扁移製程 檢出之功能。為達此目的,我們必須考慮一些關鍵 因素並找出一合理分組 (rational subgrouping) 與 管制圖建構策略且降低最後生產總成本。一個有效 率的管制圖建構策略應配合合理分組使其功能發 揮至最大並縮短檢出扁移原因所需時間。除了合理 分組外,我們亦需考慮如何去平衡檢測及生產損失 成本。為了使檢測之規畫更為經濟而有效率,我們 必須決定那些是需要檢測之關鍵製程步驟。本計畫 之主要目的是去發展出一有效率之取樣及管制圖 建構方法,這方法不但可使管制圖發揮其最大功 能,亦可使檢測及生產總成本降至最低。 In-line inspections are very important steps in semiconductor manufacturing processes. Due to the significant amount of value added on a wafer at each process step, the in-line inspection has become a crucial means to detect process excursions and to improve the manufacturing yield. An effective sampling strategy will help to achieve these goals. However, the complex nature of the manufacturing processes and the inspection technologies makes the data sampling an intricate task. In this project, we develop an integrated sampling strategy. Particularly, we focus on the strategy to achieve effective statistical process control (SPC) and process excursion investigation. To accomplish this, some key factors should be taken into considerations to determine a rational subgrouping strategy and to minimize the total cost. A rational subgroup is an inspection sample that is taken in-line and represents a homogeneous group within which sample measurements vary due only to a constant system of common causes. Choosing an effective rational subgrouping strategy and constructing corresponding control charts can maximize the power of the control chart and minimize the excursion investigation efforts. In addition to rational subgrouping and control chart construction strategies, we also need to consider the trade-off between the yield and the inspection cost. To make the inspection scheme more cost-effective, inspection points for critical process steps (layers) should be determined. The objective of this project is to develop an integrated sampling and chart construction approaches that maximize the power of SPC charts and minimizes the costs of inspections and yield loss in IC fabrication processes. |
URI: | http://ntur.lib.ntu.edu.tw//handle/246246/4171 | 其他識別: | 872213E002039 | Rights: | 國立臺灣大學工業工程學研究所 |
顯示於: | 工業工程學研究所 |
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872213E002039.pdf | 70.26 kB | Adobe PDF | 檢視/開啟 |
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