公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2015 | Multiscale Modeling of Strength and Toughness of 3D IC Intermetallic Micro Bumps | C-H Yu; C-C Lin; C-S Chen; CHUIN-SHAN CHEN | 13th U.S. National Congress on Computational Mechanics | |||
2015 | Multiscale Modeling of Strength and Toughness of 3D IC Intermetallic Microbump | C-H Yu; C-C Lin; C-S Chen; CHUIN-SHAN CHEN | First Computational Mechanics Conference in Taiwan (ACMT 2015) |